Intel Thermal Solution (HTS1155LP)

Rating:

for the processor, air cooling, fan diameter: 80 mm, Weight: 260 g

Main (Intel Thermal Solution (HTS1155LP))
The purpose processor
Cooling air
Specifications (Intel Thermal Solution (HTS1155LP))
Installed in the expansion slot
Socket LGA1150, LGA1155
Fan (Intel Thermal Solution (HTS1155LP))
The diameter of the fan 80 mm
The speed control (PWM)
Connection type 4 pin
LED-backlight
The vibration
Dimensions and weight (Intel Thermal Solution (HTS1155LP))
Width 195 mm
Depth 154.9 mm
Height 26 mm
Weight 260 g
The number of fans 1
Bearing slip sleeve)
Heat sink material copper, aluminum
Heat pipes 3
Evaporation chamber
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